WebMay 1, 2014 · Photolithography control, TSV reveal, redistribution, and metal feature dimensions, bump metrology, and defect detection, will be topics discussed in this … WebJun 24, 2024 · Contact or "Bump" Firing. Contact firing is commonly called “bump firing" because the user can quickly press or “bump” the safety tip against a surface to continuously fire nails. The sequence of controls …
(12) United States Patent (10) Patent No.: Aug. 23, 2005
WebSpecifications Inline real-time focusing Flexible platform to allow for metrology sensor integration IR defect inspection and review Large die and package support (>6400mm 2) Substrate support: 100mm - 330mm … WebMay 6, 2002 · Camtek has received acceptance for a Bump Inspection System (BIS) from one of the world's leading semiconductor companies. ... The BIS applies patent-pending 3-D metrology to inspect the location, diameter, and height of the interconnect bumps. The machine uses a white light spectrographic system to measure bump height, typically … cynthia jackson hampton inn
Condor 200 Series - Dicing-Grinding
WebApr 7, 2024 · See the latest Camtek Ltd stock price (NASDAQ:CAMT), related news, valuation, dividends and more to help you make your investing decisions. ... Bump Inspection and Metrology, and others. Contact ... WebHeight of micro-bumps on a wafer, co-planarity of bumps, deviation of bump position, and bump existence inspection. Features. This inspection system can inspect micro-bumps … WebA device for measuring a height of a microscopic structure, the device may include: a storage circuit arranged to store information that comprises amplitude information and phase information, wherein the information is indicative of a shape and a size of the microscopic structure; a mask generation circuit arranged to threshold pixels of the amplitude … cynthia jackson hammond bio